[ASE Cheonan] Design Engineer 채용

• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.

• Work closely with product development team or customers to address packaging design challenge.

• Generate and update assembly documents. Provide drafting and drawing support for package drawings.

• Support package and DFMEA reviews with process develop engineering and customers.

• Support package technology development, including material selection, process development, 

   DOEs (Design of Experiments), and related activities.

•Track and drive program milestones to ensure timely development execution.

• Provide design support for thermal/mechanical/electrical simulation analysis

• Master or Bachelor of Science degree in Electrical Engineering or Mechanical Engineering 

• +5 years of experience in semiconductor packaging industry or Electrical Engineering 

• Strong design knowledge of semiconductor packaging (wire bonding) architectures, packaging layout optimization.

• Excellent communication skills, both oral and written in English. 

• Excellent problem solving and analytic skills. 

• Experience with Auto CAD software tools or other package design software.

• Good understanding of Signal/Power Integrity, Silicon IP, floorplan.

• Ability to work independently, prioritize and manage numerous projects with minimum supervision.