Device Engineer
(신입/경력) |
ㆍIYM (Integrated Yield Management)
- Process integration for mass production
- Set KPI goal related to Yield performance
(Yield, Defect density, YLD saving$,...)
- Failure analysis and problem solving in FAB & EDS
(Electrical Die Sorting )
- Technology/process/product transfers
ㆍInterface between Assembly / Business Units and
FAB contact window for site communication
-
Primary contact window for site communication
(Design - FAB - Ass’y - QA)
- New product and process introduction to
manufacturing
- Supporting PKG level yield / quality
issues & projects
- Process Change Management |
ㆍNeed verbal and written communication
skills in English
ㆍNeed understanding of semiconductor
fabrication process, basic device physics,
statistics, DOE, and analytical skills
ㆍAbility to work with open mind and
communication actively and share
information effectively
ㆍGive priority to experienced applicant on
statistical background and semiconductor
process
ㆍBS in Electronics or Chemical, Material
Engineering related subject to Semiconductor
Process Engineering |
Defects
Management
Engineer
(신입/경력) |
ㆍDefects density management
ㆍParticle reduction activity with inspection tools
ㆍFactory quality control with defects management
ㆍTrouble solving a chronic defect
ㆍSupporting new device & new process
ㆍInteract collaboratively with Process, equipment,
production |
Epi Process
Engineer |
ㆍControl process for productivity / quality / cost /
technology
ㆍMake a plan for cost reduction, improving Cp & Cpk,
solving a chronic unit process problems, optimizing
unstable process condition, and supporting new
device & new process
ㆍInteract collaboratively with device, equipment,
production engineering |
각 공정 별 설비
Technician
(신입/경력) |
ㆍ반도체 장비의 유지보수 관리 / 신규 장비의
설치 및 사양 관리
ㆍ반도체 장비의 PM 활동 및 프로세스 개선
ㆍ반도체 장비와 관련된 스크랩의 원인 분석 및 개선
ㆍ부품(Parts)의 소모 기간 개선 및 원가 절감 활동
ㆍ작업 환경 개선 (5S and EHS) |
ㆍ전자, 전기, 반도체 관련 초대졸 이상
ㆍ 4조 2교대 근무 가능자
ㆍ대인 관계가 원만하고 다양한 레벨의 사람과
일할 수 있는 능력
ㆍ기본적인 영어 말하기 및 쓰기 능력 /
MS Office 및 Jump, Minitab
통계프로그램 경험
ㆍ반도체 생산공정 및 반도체 장비에 대한
기본적인 이해 |
| Facility Technician |
ㆍPCC : 기계 설비 유지보수 관리업무
-
Pump, blower, motor 등 회전기기 유지보수
-
Air compressor 유지보수
- 냉동기 및 에어컨 유지보수
-
진동 진단 및 판정
- 기타 자동문 등 기계장치 관리 |
ㆍ자격 요건 : 기계 관련학과 초대졸 이상
ㆍ근무 형태 : Office 근무
(향후 4조 2교대 근무 가능) |
ㆍWWT : 폐수처리 관련 업무
- 폐수처리 장비 조작, 운전 관리
- 폐수처리 관련 시설물, 화공 약품 시설 안전 관리
- 수처리 관련 수질 분석 및 data관리 |
ㆍ자격 요건 : 기계, 화공, 환경 관련 초대졸 이상
ㆍ근무 형태 : 4조 2교대 근무 |
Electronic Design
Engineer
(석사신입) |
ㆍDefine Product (SiC, Low and High Voltage MOSFETs,
IGBT, Gate Drive IC, PKG also) requirement
Specification requirements for new products into
communication with technical development
engineering.
ㆍValidate Electrical performance evaluation through
simulation and experiment as part of the Product
Verification for system application.
ㆍDesign and build new test circuits and system for
new device development support. |
ㆍTechnical Skills
ㆍDeep knowledge in power semiconductors
(SMPS) systems
( Fly back, CCM, DCM, PFC, LLC )
ㆍDeep knowledge of semiconductor device,
especially Si & SiC MOSFET, IGBT, Gate Driver
(HVIC and Galvanic)
ㆍEducation and Experience
ㆍPrefer MS or BS course graduated with
Power Electronics.
ㆍUnderstanding Power Electronics and Power
Semiconductor Device. |
Image Sensor
Digital Engineer
(학부 및 석사신입
지원가능)
*근무지 : 양재 |
ㆍThis position is responsible for image sensor
development from RTL to test setup such as timing
controller design, ISP, Synthesis, STA, Test
development and etc.
ㆍLogic Design / Back-End Processes / Functional
verification of several million gate ASICs, setup
verification environments |
ㆍFamiliar with digital design flow, image sensor
digital design and verification
ㆍincluding verilog RTL coding/simulation,
synthesis, static timing analysis, and formality.
ㆍUse C, C++, MATLAB, Perl programming
language for design verification or modeling. |
Auto Application
Engineer
(석사신입 가능) |
ㆍDefine Product (SiC, Low and High Voltage
MOSFETs, IGBT, Gate Drive IC, PKG also) requirement
Specification requirements for new products into
communication with technical development
engineering
ㆍIn-depth knowledge related automotive application
such as OBC and Motor drive system with strong
analytical and problem solving skills. |
ㆍDeep knowledge in power semiconductors
(SMPS) systems
(Fly back, CCM, DCM, PFC, LLC )
ㆍDeep knowledge of semiconductor device,
especially Si & SiC MOSFET, IGBT, Gate Driver
(HVIC and Galvanic)
ㆍPrefer MS course with related company
experience or BS course graduated with Power
Electronics/Power Semiconductor with related
company experience
ㆍUnderstanding Power Electronics and Power
Semiconductor Device |
APM Product
Marketing
Engineer |
ㆍFeasibility study of a new product at product
concept stage
ㆍSelection for proper technology, die size estimation,
risk analysis, development schedule
ㆍUnderstanding of design spec in addition to system
requirement
ㆍPlan for IC design and verification |
ㆍBS or MS in Electric/Electronic engineering
ㆍ5 years experience of IC development
ㆍUnderstanding of device physics and power
technology
ㆍExperience of IC design from sub block level
design to top level design/verification
ㆍSkill of DFM(PVT corner sim, Monte Carlo)
methodology, parasitic analysis
(layout, package)
ㆍSkill of design and layout tools
(Cadence, Mentor) |
APM Product
Engineer |
ㆍProduct engineers - representing the BU to provide
product engineering support to customer, work with
manufacturing and quality engineering teams to
improve quality, cost, on-time delivery (OTD) of the
assigned product lines.
ㆍThe engineer will mainly support Auto SiC &
Module products and be the main interface btw the
business Unit and manufacturing both front end
(FAB) and back end (Assembly/Final Test sites) on
product related matters. |
ㆍ~3 year experience as device engineer or
product engineer, other similar experiences in
semiconductor industry.
ㆍNice to have the experience for
supporting/resolving Semiconductor
production issues such as yield/parametric
data analysis and disposition, Manufacturing/
customer support, Product yield improvement,
test time & cost reduction projects, process
enhancement.
ㆍPrefer MS course with related company
experience or BS course graduated related to
Power Electronics/Power Semiconductor with
related company experience
ㆍUnderstanding Power Electronics and Power
Semiconductor Device |
Automotive
products
Applications
Engineer |
ㆍWork with a team of Automotive products
Applications Engineers supporting BU objectives
ㆍDefine Product (SiC, Low and High Voltage
MOSFETs, IGBT, Gate Drive IC, PKG also)
requirement Specification requirements for new
products into communication with technical
development engineering
ㆍProvide collateral material: datasheets, applications
notes, and user guides |
ㆍDeep knowledge in power semiconductors
(SMPS) systems
(Fly back, CCM, DCM, PFC, LLC )
ㆍDeep knowledge of semiconductor device,
especially Si & SiC MOSFET, IGBT, Gate Driver
(HVIC and Galvanic)
ㆍPrefer MS course with related company
experience or BS course graduated with Power
Electronics/Power Semiconductor with related
company experience
ㆍUnderstanding Power Electronics and Power
Semiconductor Device
|
NPD Layout
Design Enginee |
ㆍLayout support for NPD project
ㆍSiC derivative technology development from the
proven new technology.
ㆍTechnical support for issues in production |
ㆍAbove BS degree if possible
ㆍ5-8 years of experience in semiconductor
layout
ㆍProfessional in Cadence layout tools |
| Test Engineer |
ㆍResponsible for sort & final test trouble shooting,
program development, yield improvement, PQA
Analysis of Discrete product.
ㆍDevelop and release to manufacturing test solutions
utilizing Eagle ETS200T,ETS364B, TESEC SP20, and
other MOSFET/IGBT ATE pl atf orms.
ㆍCost saving activity through test time reduction.
ㆍYield improvement, manufacturing ramp and
throughput optimization of new products.
ㆍSort data analysis by PDF Exensio YMS system.
ㆍTest development projects such as ultra low
resistance (Rdson)
ㆍMeasurement static and dynamic(UIL/SW/ Rg)
test coverage
ㆍOptimization/improvement, and test efficiency
improvement for high performance and multi site
testing, high current/voltage test ing. |
ㆍ학력 : 대졸이상 (졸업예정자 가능)
ㆍUnderstanding of basic semiconductor
physical properties and electronic circuit.
ㆍExcellent inter personal skills, able to work well
with different levels of people.
ㆍNeed oral and written communication skills,
including presentation skills in English
ㆍGood software skill and knowledge (Excel,
Word, PowerPoint, Jump, Minitab, C++, etc.) |
